Thermal Compound Type and Application Process for IGBTs and Diode Modules |
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Thermal compound paste is required when mounting an IGBT (insulated gate bipolar transistor) module(s) or diode module(s) to a drive heatsink. |
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Refer to the chart below for the required thermal compound paste and for visual instructions on applying the thermal compound.
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GA800, GA800 Configured, GA500, HV600, HV600 Bypass, HV600 Configured, 1000 Series, C11, AC7, A1000, 7 Series, 5 Series, A1000 Configured, C21, E7, G5, A1000 HHP, E7B Bypass, E7BR, E1000, G5 HHP, E7BR Bypass Nema 3R, H1000, GL5, iQpump VTC, iQpump Micro-4X, iQpump Micro, iQpump1000, H5, E7C Configured, P5, iQpump1000 Bypass, E7CR, E7E Engineered, P5B, E7L Bypass, PS5, E7N Bypass, iQpump Micro Configured, E7S Slim Configured, F7, iQpump1000 Configured, F7C Configured, iQrise, J1000, FS7, G7, L1000, G7C Configured, P1000, P1000 Bypass, iQpump 7 Series, P1000 Configured, J7, L7, U1000 Industrial, U1000 Industrial Configured, U1000 iQpump, P7, P7BR, U1000 iQpump Configured, U1000L, P7 Bypass, P7C Configured, U1000 Oil and Gas, V1000, P7CR, P7 Slim Configured, V1000-4X, PPBB, Z1000, PPBR, Z1000 Bypass, PPCB, Z1000 Configured, Z1000 Redundant Bypass, PPCR, Z1000U, V7, V74X, Z1000U Bypass, V7C Configured, Z1000U Configured, V7CX Configured, V7N, V7N4X, |
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Last Modified Date: 11-22-2022ID: 10567 |
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